Appleposted 3 days ago
$188,200 - $325,500/Yr
Full-time • Manager
Computer and Electronic Product Manufacturing

About the position

Imagine what you could do here. At Apple, new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Smart people and inspiring, innovative technologies are the norms here. Do you love working on challenges that no one has solved yet? Are you ready to be part of a team transforming wireless technology? Join us to help deliver the next groundbreaking Apple product. Wireless Technologies team is looking for a highly motivated and strong technical lead to work on our next-generation products. The duties of this position will lead a team to design, develop, debug baseband platform software, and work with HW & SW multi-functional teams to deliver the features into next-generation products. CoreBSP Enablement team mainly responsible for CoreBSP and Power/Thermal SW enablement and handling of CoreBSP system-level issues that can bridge the gap between HW & SW Teams. This group deals with common HW&SW platform infra enablement for Pre-silicon and Post-Silicon SW enablement across all platforms and unblocking SW teams.

Responsibilities

  • Lead debugging, analysis, and root cause efforts for cross-functional, system-level issues spanning boot, RTOS kernels, core drivers, memory, Power, Thermal, cellular protocols, etc.
  • Work with multiple teams throughout the product lifecycle, in both pre-silicon and post-silicon environments, to identify and resolve issues across SoC, hardware, and software domains.
  • Provide technical guidance, prioritization, and milestone delivery leadership for the team.
  • Drive retention of key talent and lead recruitment for new team members.

Requirements

  • Bachelor's and/or Master's degree in Electrical Engineering, Computer Engineering, Computer Science or equivalent.
  • 5+ years of team management and leadership experience.
  • Deep understanding of, or ability to gain deep expertise in, CPU processors, SoC architectures, and RTOS kernels.
  • Extensive development experience with strong skills in Assembly, C, and C++.
  • Advanced debugging expertise using gdb/lldb, JTAG/ETM, and RAM dump analysis on both FPGA and hardware platforms.
  • Hands-on experience in pre-silicon and post-silicon software bring-up, validation, and debugging of hardware-dependent software (Board Support Package: BSP).

Nice-to-haves

  • Proven success working in dynamic, fast-paced, multi-tasking environments.
  • Excellent written and verbal communication skills with the ability to collaborate effectively with diverse teams.
  • Strong leadership, interpersonal, and initiative-taking skills.

Benefits

  • Comprehensive medical and dental coverage
  • Retirement benefits
  • A range of discounted products and free services
  • Reimbursement for certain educational expenses — including tuition
  • Discretionary bonuses or commission payments
  • Relocation assistance
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